电子元件可靠性和典型可靠性问题

电子元件可靠性和典型可靠性问题

IC reliability and typical reliability topics

【课程目标】

理解电子装联技术

了解可靠性、质量认证及测试；

了解塑料封装器件的潮气敏感性及相关问题

理解电子器件静电防护和过电损伤

【课程大纲】

电子装联技术 Electronic manufacturing

电子芯片晶元制造 Wafer fabrication

电子元件封装 Electronic packaging

电子元件电路板组装 Electronic component assembly

可靠性、质量认证及测试 Reliability、Qualification and test

微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems

可靠性描述和浴盆曲线 Reliability description and bathtub curve

常见可靠性模型和加速因子估算 Common reliability model and active factor estimation

可靠性试验和认证 Typical reliability tests

器件结构分析 Package construction analysis

塑料封装器件的潮气敏感性及相关问题 Moisture Sensitivity and Relevant Issues

塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象

Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.

器件湿气敏感性分级：JESD020:非气密性表面封装固态电路的水汽/回流敏感性等级

Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？

How to judge the root cause when popcorn crack happens: device quality or SMT problem?

器件怀疑吸湿如何处理：实用指南

What to do, if your devices are susceptible of excessive moisture absorption: a practical guide

电子器件静电防护和过电损伤 ESD and EOS

静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish

器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test

静放电控制和检查 Typical ESD control and checklist in manufacture process

电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification

典型案例 Case study